4 Layer PCB Assembly:
Chip-on-Board (COB)
Oberflächenmontagetechnik (SMT)
Ball-Grid-Array (BGA)
Durchgangsloch
Vorteile:
- Der One-Stop-Service umfasst die PCB-Fertigung und PCBA.
- Komponentenbeschaffung
- Kosteneffizient
- Mindestbestellmenge 1 Stück
Service:
- PCB fabrication
- Komponentenbeschaffung
PCB Assembly Capability:
The Minimum PCB Dimension: 50x40mm |
The Maximum PCB Dimension:600x400mm |
The Maximum Component Height: 25mm |
The Maximum PCB Weight: 3KG |
The Minimum Components Size: 0201(0.5×0.25mm),Flip-CHIP,QFP,BGA,POP |
The Maximum Components Size: 55mm |
The Minimum PCB Dimension: 50x40mm |
The Maximum PCB Dimension : 510x460mm |
The BGA/QFP pitch :0.3mm |
Testing: ICT, Burn-in, Function Test,Temperature Cycling |
The Lead time of PCB assembly: 7-10 WDS |