RF microwave PCB:
Layers : 2 Layer
PCB Material: Telfon PTFE
Board Thickness: 0.8mm
Surface Finishing: Flash Gold
완성된 구리 두께: 1/1 OZ
솔더 마스크: 녹색 색상
특수 기술:
Telfon material.
High Frequency PCB Capability:
Circuit Trace Width/Space: 3/3mil
The Minimum Via size: 0.15mm
The Minimum Annular Ring Width: 3mil of via, 5mil of component holes
The Minimum legend Height/Width: 24/5mil
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Immersion Silver,Plated Silver
Max Board Dimension: 600mm x 600mm
Final Board Thickness: 0.5mm ~ 5.0mm
최종 구리 두께: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
Metal Type: Rogers4003,Rogers4350,Rogers 3010,Teflon PTFE,Arlon
Solder mask colour: White, Black, Green,Red, Yellow,Blue,Grey
Shaping: Tooling Punching,CNC Routing,V-CUT
특수 구멍: 블라인드 및 매립 구멍, 깊이 밀링, T-슬롯, 카운터싱크 구멍