Blind and Buried Vias:
PCB Layer: 12 Layer
Material: FR4 High TG
Board thickness: 5.0mm,
Finishing copper thickness: inner and outer 1/1oz,
Surface finished: Hard Gold plating.
Special technology:
- Hard Gold plating, gold thickness 30u.”
- Blind & Buried Vias.
HDI&Microvia(blind buried) PCB Capability:
Minimale Leiterbahnbreite/-abstand: 2,7/2,7mil |
The Minimum Via Size: 0.1mm |
Minimale Legendenhöhe/-breite: 0,5 mm/0,12 mm |
Surface Finishing: HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin |
Special Technology: Blind&buried via, Via In Pad, Backdrill, Small BGA Pad, Impedance control, Heavy Copper, Copper Filled Vias, Countersink hole, Depth Milling |
Materialtyp: FR4, Metallkern, halogenfreies FR4, Rogers, PTFE, Arlon, Nelco, Polyimid |
Maximale Plattenabmessung: 1200 mm x 600 mm |
Endgültige Plattendicke: 0,4 mm – 6,0 mm |
Endgültige Kupferdicke: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
Dicke des FR4-Substrats: 0,1 mm 0,2 mm 0,3 mm 0,4 mm 0,5 mm 0,6 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm 2,36 mm |
Lötstopplackfarbe: Grün Weiß Schwarz Rot Blau Gelb |
Shaping: CNC Routing, Punching, V-CUT, Depth milling, Castellation |
Special Hole: Blind&buried hole, Depth milling, T-slot, Countersink hole |