PCBA is the abbreviation of Printed Circuit Board Assembly. PCBA manufacturing is the process of attaching electronic components to a Printed Circuit Board by SMT production and through hole assembly. This process involves a combination of automated and manual tasks such as soldering, surface mount technology (SMT), through-hole technology (THT), and quality inspection. PCBA manufacturing is an essential step in electronic devices.
The last step of rigid PCB manufacture is open/short circuit test to ensure the quality of the rigid PCB board.
General samples and small batches of rigid PCB circuit boards are tested with flying probes, which can reduce the cost of making test frames, then shorten the delivery cycle. The mass-production rigid PCB boards are tested by test tooling.
PCB board size and layer count need to be determined in the early stages of PCB design. The layer count will directly affect the PCB routing and impedance. The PCB dimension will help to achieve the purpose of PCB design.
In the PCB design process, the first is the correct layout, which is the most basic PCB design entry requirement. Secondly, the electrical performance, which is a measure of a PCB board is a qualified standard.Once again, optimize the PCB circuit routing to meet test convenience, neat and tidy.
Quality control is an important part of PCB design. It includes Self-inspection, mutual inspection, special inspection, etc. Check whether the empty foot of each component is normal and whether it is a leakage line. Check whether the upper and lower wiring of the same network table has holes, and whether the pads are connected through the holes to prevent wire breakage and ensure the integrity of the line.
Los siguientes son los principales procedimientos de producción de tableros multicapa convencionales.
Corte de materiales: El material de corte es el área grande (48 x 42 pulgadas) de materia prima que se corta en el panel de trabajo que necesitan los fabricantes de PCB.
Capa interna: The inner layer of the circuit uses positive imaging technology, After developing, etching, and de-filming processes, complete the production of the inner layer of the line.
Óxido negro: Black Oxide is made before lamination. The main role is to roughen the copper surface and increase the surface contact area with the resin to ensure the quality of lamination.
Laminación: Stack up the inner core and prepreg to press into multilayer board through vacuum pressure machine. And make the tooling holes for the next process.
Drilling: Using CNC drilling machine, through holes are drilled for circuit connections between layers.
Cobre no electrolítico: Electroless copper is chemically deposited, copper. The method deposits a thin copper layer in the non-conductive substrate so that the through-holes are metallization. Then use the plating method to thicken the hole’s copper thickness to achieve the design purpose.
Revestimiento de cobre: El revestimiento de cobre es un método de galvanoplastia para aumentar el espesor de los orificios pasantes y las superficies del circuito.
Capa exterior: Transfiera el patrón exterior a la placa revestida de cobre y grabe el cobre inútil.
Carácter de resistencia a la soldadura: Impresión de una capa de tinta de máscara de soldadura aislada en la superficie de la capa exterior. Algunos PCB también necesitan tener símbolos impresos en la capa de máscara de soldadura.
Surface treatment: Common PCB surface treatments include HASL, OSP, Immersion Gold, ENEPIG, Immersion Silver, Immersion Tin, and Gold finger plating.
Prueba eléctrica: All the PCBs must be pen/short tested before outgoing, the test included electrical test and flying probe test. Electrical test for PCB mass production and flying probe test for samples as it’s fast turn round.
Hay dos tipos principales de fabricación de PCBA: tecnología de montaje superficial (SMT) y tecnología de orificio pasante (THT).
El ensamblaje SMT de placa de circuito impreso es una tecnología de ensamblaje de circuito que suelda componentes a la superficie de una placa de circuito impreso mediante soldadura por reflujo o soldadura por inmersión. La fabricación de PCBA SMT se utiliza normalmente para dispositivos electrónicos compactos, livianos y de alta densidad, como teléfonos inteligentes, tabletas y computadoras portátiles.
Through-hole Printed Circuit Board assembly also named DIP involves inserting electronic components through pre-drilled holes in the PCB, and then soldering the leads to the other side of the board. Through-hole Printed Circuit Board assembly is used for heavy-duty electronic devices, such as industrial equipment and high-end audio gear.Most electronic devices are the combination of both SMT and THT assembly methods to achieve a balance between size, weight, and durability.
Here are some characteristics of PCBA manufacturing
El conjunto de placa de circuito impreso puede ser un volumen pequeño, liviano y de alta densidad de productos electrónicos. Generalmente, el volumen de los productos electrónicos se reduce en 40%-60% y el peso se reduce en 60%-80% después de utilizar el proceso SMT.
PCBA manufacturing is high reliability, strong vibration resistance, and low solder joint defect rate.
PCBA manufacturing has the strong anti-interference ability and better electromagnetic compatibility.
La mayor parte de la fabricación de PCBA se automatiza mediante maquinaria especializada. Esto no sólo aumenta la eficiencia de la producción, sino que también garantiza la coherencia y la precisión, y reduce los costos de materiales y el tiempo de mano de obra.
PCBA manufacturing mainly uses three major materials, which are solder paste, flux, and SMT glue.
Solder paste is made of alloy solder powder and paste flux evenly stirred, it is an indispensable soldering material in the SMT chip processing process, widely used in reflow soldering. Solder paste has a certain viscosity at room temperature, and can be electronic components initially stick in the established position.
Flux is the carrier of tin powder, and its composition is basically the same as that of general-purpose flux. In order to improve the printing effect, it is sometimes necessary to add an appropriate amount of solvent, through the action of the activator in the flux.
El pegamento SMT, también conocido como adhesivo SMT o pegamento rojo SMT, suele ser una pasta roja (también amarilla o blanca) que se distribuye uniformemente con endurecedores, pigmentos, disolventes, etc., y se utiliza principalmente para fijar los componentes en el tablero impreso. Generalmente, utilizamos el método de dosificación o impresión con plantilla para distribuir y luego colocamos los componentes en el horno o en el horno de reflujo para calentarlos y endurecerlos.
| Artículo | Parámetros técnicos | Especificación |
| Ancho/espacio mínimo de línea del circuito | 3/2,7 mil | Espesor de cobre acabado H oz |
| Anillo de almohadilla de PCB mínimo de vía | 3 millones | Distancia entre el borde del agujero y el borde del anillo |
| Anillo de almohadilla de PCB mínimo de PTH | 5 millones | Distancia entre el borde del agujero y el borde del anillo |
| PCB mínimo por tamaño | 4 millones | Grosor del tablero < 1,2 mm |
| Grosor mínimo de PCB de doble cara | 0,2 milímetros | Espesor final del tablero |
| Grosor mínimo de PCB de multicapa | 0,4 milímetros | Espesor final del tablero |
| Grosor máximo de PCB | 8,0 milímetros | Espesor final del tablero |
| Dimensión máxima de PCB | 609×609 milímetros | PCB de una y dos caras |
| Espacio entre la línea y el borde del tablero | 10 millones | Fresado de contorno |
| Capas máximas de PCB | 30 capas | |
| Color de máscara de soldadura de PCB | Verde, Negro, Azul, Rojo, Blanco, Amarillo, | |
| Color de serigrafía de PCB | Blanco, negro, amarillo | |
| Acabado de superficies de PCB | HASL,ENIG,ENEPIG,ImAg,ImTin,OSP, Hard Gold Plating | |
| Espesor máximo de cobre de acabado | 6 onzas | |
| Espesor dieléctrico | 2,5 millones | |
| Material de PCB | FR-4, sustrato de aluminio, Rogers4350C, poliimida | |
| Tecnología especial | HDI PCB, Via in Pad PCB,Blind&Buried PCB |
| Artículo | Parámetros técnicos | Especificación |
| Ancho/espacio mínimo de línea del circuito | 3/2,7 mil | Espesor de cobre acabado H oz |
| Min rigid PCB Pad Ring of Via | 3 millones | Distancia entre el borde del agujero y el borde del anillo |
| Min rigid PCB Pad Ring of PTH | 5 millones | Distancia entre el borde del agujero y el borde del anillo |
| Min rigid PCB Via Size | 4 millones | Grosor del tablero < 1,2 mm |
| Min rigid PCB Thickness of Double sided | 0,2 milímetros | Espesor final del tablero |
| Min rigid PCB Thickness of Multilayer | 0,4 milímetros | Espesor final del tablero |
| Max rigid PCB Thickness | 8,0 milímetros | Espesor final del tablero |
| Max rigid PCB Dimension | 609×609 milímetros | PCB de una y dos caras |
| Espacio entre la línea y el borde del tablero | 10 millones | Fresado de contorno |
| Max rigid PCB Layers | 30 capas | |
| Rigid PCB Solder Mask Color | Verde, Negro, Azul, Rojo, Blanco, Amarillo, | |
| Rigid PCB Silkscreen Color | Blanco, negro, amarillo | |
| Rigid PCB Surface Finishing | HASL,ENIG,ENEPIG,ImAg,ImTin,OSP, Hard Gold Plating | |
| Espesor máximo de cobre de acabado | 6 onzas | |
| Espesor dieléctrico | 2,5 millones | |
| Rigid PCB Material | FR-4, sustrato de aluminio, Rogers4350C, poliimida | |
| Tecnología especial | HDI PCB, Via in Pad PCB,Blind&Buried PCB |
Accurately apply solder paste or adhesive onto the PCB pads in preparation for component placement.There are three types solder paste machines: manual printing machines, semi-automatic printing machines and fully automatic printing machines.
Utilize the equipment-edited program to precisely position the components onto the designated locations of the PCB.The placement machine involves high-speed placement machine and multi-function placement machine.High-speed placement machines are generally used to mount small chip components.The multi-function placement machine is mainly used to mount roll-shaped, disc-shaped or tubular large components or abnormal shape components.
Ubicado detrás de la máquina de colocación en la línea de producción SMT, este dispositivo crea un ambiente calentado que facilita la fusión de la pasta de soldadura en la almohadilla. Como resultado, los componentes de montaje en superficie y las almohadillas de PCB se unen firmemente entre sí mediante soldadura en pasta.
When AOI is automatically detected, the machine scans the PCB through its camera, automatically collecting images. It then compares the tested solder joints with qualified parameters stored in the database, and checks for defects on the PCB through image processing. Any defects are displayed and marked on the display, allowing maintenance personnel to quickly identify and repair them.
PCBA manufacturing is an important technology that enables the development of complex electronic devices that are used in a wide range of industries and applications. Below are some common applications.
PCBA manufacturing is used in a range of consumer electronics, including smartphones, tablets, laptops, televisions, and home appliances.
PCBA manufacturing is used in automotive applications for electronic control units, sensors, and other critical components.
PCBA manufacturing is used in industrial automation applications for controlling machinery, monitoring sensors, and handling data.
PCBA manufacturing is used in medical equipment for patient monitoring, diagnostics, and treatment.
PCBA manufacturing is used in aerospace and defense applications for controlling and monitoring aircraft systems, satellite communication, and military equipment.
PCBA manufacturing in King Sun can offer a combination of affordability, quality, and scalability that makes it an attractive option for businesses. There are several advantages of PCBA manufacturing in King Sun.
PCBA manufacturing in King Sun is typically much more cost-effective than in many other factories, due to the lower cost of labor and materials.
Despite the lower cost, PCBA manufacturing in King Sun can still be of high quality. We imported production and testing equipment from the United States, Japan, and other countries to help companies improve PCBA manufacturing and testing capabilities.
King Sun is one of the largest producers of Printed Circuit boards and PCBA in China, which means that it has the capacity to produce large quantities of circuit boards and PCBA manufacturing quickly and efficiently.
King Sun has experience in producing circuit boards for a wide range of applications and industries, including automotive, telecommunications, and consumer electronics. This means that we can scale our production to meet the needs of different clients.
King Sun has our own Printed Circuit Board factory and assembly factory, so the lead times can be very fast than other suppliers, which can be a significant advantage for clients who need their products quickly.
