Rigid PCB board is a conventional Printed Circuit Board. It cannot be bent or flexed.
A Rigid PCB board is one of the important components of electronics product manufacture. Almost every electronic product must be used PCB board, from small watches, and calculators to computers, electronic communication equipment, and even military weapon systems.
Single sided flex PCB the simplest Flex board, it has only one copper layer. It is usually processed on the basis of two raw materials: “base material, glue and copper foil” and “coverlay and glue”. The base material used by flexible printed circuit is generally polyimide (PI), but not limited to, it can also be polyethylene terephthalate, aramid fiber ester and polyvinyl chloride.
2 Layer flexible printed circuit contains top and bottom sides copper, it’s increased the wiring density per unit area. Generally, when the wiring of the circuit is more complicated, and the single sided flex PCB cannot meet the wiring requirements, the 2 Layer flexible circuit board will be selected. Compared with single sided Flex PCB, the biggest difference between 2 Layer flexible circuit board is added vias structure to connect two layers of copper foil (that is, two layers of conductive patterns) to form a conductive path.
4 Layer flexible printed circuit is to press single sided and 2 Layer flex PCB together, metallized through holes and electroplating, and form conductive paths between different layers. In this way, no complicated welding process is required. Compared with single side flex PCB and 2 Layer flexible circuit board, 4 Layer flexible PCB has higher reliability, better thermal conductivity, and more convenient assembly. But it loses the excellent flexibility of single and 2 Layer flexible circuit board. However, there is also a compromise option, that is 4 layer Flex PCB.
Flexible printed circuit boards can be bent, wound and folded freely. Also it can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched in three-dimensional space arbitrarily, so as to achieve the integration of component assembly and wire connection
The use of flexible printed circuit can greatly reduce the volume and weight of electronic products. Suitable for the development of electronic products in the direction of high density, miniaturization and high reliability.
Flexible printed circuit also has good heat dissipation and solderability and is easy to assemble, low overall cost advantages. The design of the combination of FPC PCB and rigid PCB also makes up for the slight deficiency of the flexible substrate in the load-bearing capacity of the components to a certain extent.
| Artikel | Technische Parameter | Spezifikation |
| Min. Flex-PCB-Leitungsbreite/-abstand | 2/3 Mio. | Fertige Kupferstärke H oz |
| Min Flex PCB Pad Ring von Via | 3 Mio | Abstand zwischen Lochrand und Ringrand |
| Min Flex PCB Pad Ring von PTH | 5 Mio | Abstand zwischen Lochrand und Ringrand |
| Min. Via-Größe für Flex-PCBs | 4 Mio | |
| Mindestdicke der doppelseitigen Flex-Leiterplatte | 0,1 mm | Endgültige Plattendicke |
| Mindestdicke der flexiblen Leiterplatte bei Multilayer-Leiterplatten | 0,2 mm | Endgültige Plattendicke |
| Maximale Dicke der Flex-Leiterplatte | 0,35 mm | Endgültige Plattendicke |
| Maximale Flex-PCB-Abmessungen | 260×620 mm | Ein- und doppelseitige Leiterplatte |
| Abstand zwischen Linie und Brettkante | 8 Millionen | Konturfräsen |
| Max Flex PCB-Schichten | 8 Schichten | |
| Farbe der Lötmaske für flexible Leiterplatten | Gelb, Schwarz, Weiß | |
| Flex PCB Siebdruckfarbe | Weiß schwarz | |
| Oberflächenbearbeitung von FPC-Leiterplatten | ENIG, ENEPIG, ImAg, ImTin, OSP, Vergoldung | |
| Maximale Endkupferdicke | 3 Unzen | |
| Dielektrikumsdicke | 2,5 Mio | |
| Flexibles Leiterplattenmaterial | ShenYi Stand Polyimid, halogenfreies Polyimid, Klebstoff und Versteifung | |
| Flex-Versteifungsmaterial | FR4-Versteifung, Polyimid-Versteifung, Stahl-Versteifung |
Die drei Elemente des flexiblen PCB-Materials: Kupferfolie, Klebstoff, Polyimid und Polyester.
Copper foil can generally be divided into electrolytic copper foil and rolled copper foil. Electrolytic copper is formed by separating copper ions in copper sulfate solution by electric current, and then it is completed after anti-oxidation and roughening treatment. Its characteristic is strong electrical conductivity, but relatively weak bending resistance. Rolled copper foil is made by rolling the copper plate repeatedly, and its crystallization is a lamellar structure. It has good flexibility.
ADH is an adhesive, which is the most important part in the manufacturing process of flexible copper clad laminates. Many important performance indicators in the board are determined by the performance of the glue. For example: peel strength between dielectric substrate and metal foil, flexural resistance, chemical properties, moisture resistance, adhesive layer flow properties, etc.The adhesive used in flexible copper clad laminates must be able to withstand various process conditions and the erosion of chemicals used in the manufacture of flex printed circuit boards, without delamination or degradation.
Polyimide&Polyester contains PI base Flexible Printed Circuitmaterial, PI coverlay, PI stiffener material PI base material: Flexible PCB printed circuit board materials are divided into two types: those with glue and those without glue. Whether it is a material with glue or without glue, Polyimide is a must indispensable.PI coverlay: Its main function is for circuit insulation.PI stiffener material: It is often used in the area on the back of the whole finger of FPC PCB, and the PI ribs are used to increase the complexity and hardness of the fingers, making it easy to insert and remove.
Mobile electronic devices such as smartphones and tablets, There are flexible printed circuit in the camera module, capacitive screen connection part, button part, optical drive induction head, receiving antenna and other parts of the PC.
Flexible Printed Circuits are widely used in high-tech electronic fields such as communications, computers, instruments, automobiles, medical care, industrial control, home appliances and CNC machine tools, camera modules, and intelligent battery management modules.
Mobile electronic devices such as smartphones and tablets, There are flexible printed circuit in the camera module, capacitive screen connection part, button part, optical drive induction head, receiving antenna and other parts of the PC.
Driven by emerging markets such as 5G and wearable devices, Flexible printed circuit will also use in new growth space.
Flexible printed circuit widely use in Camcorder, CDRW cubic element patch,CD RW drive parts,PDP, Camera Module, Laser Printer Head drive parts, Mobile phone electromagnetic wave shielding.
The flexible printed circuit board material is generally a roll of 250mm wide 50M or 100M long PI base material covered with a certain thickness of copper on one or both sides of the copper foil. Therefore, we need to cut the large roll into a work board according to the size of the manufacturer’s instructions.
Das Bohren ist der zweite Schritt im Herstellungsprozess flexibler Leiterplatten, und die Qualität des Bohrens steht in direktem Zusammenhang mit der Funktion und Genauigkeit des Produkts.
Along with the continuous development of high-density flexible PCB, Traditional mechanical drilling technology can no longer meet the market demand for small hole diameter, high precision and high efficiency. Laser drilling has become the mainstream processing technology for flexible PCB microvias.
VCP electroplating line using Faraday’s theorem (the thickness of the coating is proportional to the current density and plating time) to plat the hole wall of the flexible printed circuit board to copper thickness following IPC standard or required by customer.
Composed of PE, photoresist and PET, paste dry film on the flexible printed circuit board, so as to achieve the function of image transfer, and protect the circuit during the etching process.
Entsprechend der dem Arbeitsauftrag entsprechenden Filmbelichtung wird das Bild des flexiblen gedruckten Schaltungsgrafikfilms auf den Trockenfilm übertragen (fertiggestellt in der staubfreien Werkstatt auf Ebene 10.000) und die Hauptausrüstung ist eine automatische Belichtungsmaschine.
The part of the dry film that is not exposed to light will be washed off by NaCO3, and the dry film on the trace and copper will not be washed off. Useful wiring and copper of flexible printed circuit board are preserved
Beim Ätzen flexibler Leiterplatten wird unerwünschtes Kupfer von einer Leiterplatte entfernt.
Etching has acid etching process (ferric chloride and copper chloride) and alkaline etching process (ammonia). The acid method is used to etch the inner layers of flexible printed circuit board, it is accurate and cheap but time consuming. The alkaline method is used to etch the outer layer of the flexible PCB, which is fast and expensive.
Flexible printed circuit board dry film stripping removes the protective dry film layer on the FPC circuit board through a chemical reaction. This process is usually done using chemical solutions, which can decompose the chemical substances in the film layer and expose the flex printed circuit board.
Bei der Entwicklungs- und Ätzfilmentfernungsanlage handelt es sich um eine horizontale DES-Linie.
Flexible printed circuit board coverlay film, generally also called protective film, protects the circuit from oxidation and covers it for subsequent surface treatment. If the area that does not need gold plating is covered with coverlay. In the subsequent SMT soldering, the role of prevent welding.
Durch Pressen bei hoher Temperatur und hohem Druck, gefolgt von Backen bei hoher Hitze, wird der wärmehärtende Klebstoff zwischen der Deckfolie und der Platte ausgehärtet, um den Zweck der festen Verbindung der beiden zu erreichen. Die Aushärtungsarbeitsparameter sind eine Temperatur von 150 ° C, 1 Stunde. Die Hauptausrüstung sind Schnellpressen und Öfen;
Die Oberflächenbehandlung flexibler Leiterplatten erfolgt hauptsächlich durch Tauchgold oder ENEPIG. Je nach Kundenwunsch werden Metalle wie Nickel und Gold mithilfe chemischer oder galvanischer Verfahren auf die freiliegenden Pads flexibler Leiterplatten aufgebracht, um die Pads zu schützen und ihre Lötbarkeit zu erhalten. Die Hauptausrüstung besteht aus vergoldeten Leitungen und vergoldeten Leitungen.
Check whether there are open and short circuits between different networks of the flexible printed circuit board, four-wire failure, etc. through test fixtures or equipment. The main equipment is an electric test machine and a flying probe test machine;
Der Zweck des Aufklebens eines Flex-PCB-Versteifungselements besteht darin, die mechanische Festigkeit der flexiblen Leiterplatte zu erhöhen und die Montage von Teilen auf der Oberfläche der Leiterplatte zu erleichtern.
Zu den FPC-Versteifungsmaterialien gehören gängige Polyimid-Versteifungen, FR4-Versteifungen und Stahlversteifungen.
FR4 stiffener main components are glass fiber cloth and epoxy resin glue, which is the same as the FR4 material used in PCB.
Steel stiffener is made of steel, which has strong hardness and support strength. Manual assembly is required, the process is more complicated, and the cost will be higher.
PI stiffener is as same as the coverlay film, consisting of PI and adhesive release paper, but the PI layer is thicker, can be processed and produced from 0.05mm to 0.25mm, the tolerance can be controlled at +/- 0.03mm, and the precision is high , high temperature resistance (100°C-280°C).
Print the text ink on the flexible printed circuit board through the principle of screen printing, mainly printing the product model, production date code, and various component identifications required by customers, etc. The main equipment includes screen printing machines, ovens, text inkjet printers, etc.;
Flexible printed circuit board punching is a link in the FPC process, which is equivalent to a cutting workstation. At present, the main equipment used in this workstation on the market is flex circuit punching machine and FPC UV laser cutting machine.
Das Prinzip der Stanzmaschine für flexible Leiterplatten besteht darin, durch den Zylinder Druck auszuüben, um die Messerform in den Träger zu drücken und so das Schneiden der flexiblen Schaltung in einem Schritt durchzuführen.
Das Prinzip der Laserschneidmaschine für flexible Leiterplatten besteht darin, die Oberfläche der FPC mit einem energiereichen und hochdichten Laserstrahl zu bestrahlen und ihn durch den vibrierenden Spiegel hin und her zu bewegen, um eine Schnittschicht aus Glasmaterial zu bilden.
Durch manuelle Sichtprüfung und CCD-Geräte können das Aussehen und der Oberflächenzustand der flexiblen Leiterplatte vollständig überprüft, gute von fehlerhaften Produkten getrennt und Zuverlässigkeitstests am Produkt durchgeführt werden, um zu bestätigen, ob es die Kundenanforderungen erfüllt.
Packaging and shipping flex circuits are carried out according to customer requirements. The main packaging methods include vacuum packaging, micro-membrane packaging, tray packaging, etc.
King Sun is a Flex PCB manufacturer with high quality and advanced flexible PCB. We make flex PCB prototype with quick turn lead time, below is our quick turn flex circuits list:
| Anzahl der Schichten | Standardlieferzeit | Schnell umdrehen |
| 1-2 Schichten | 4-5 TAGE | 24 Stunden |
| 4 Schichten | 5-6 TAGE | 48 Stunden |
| 6 Schichten | 7-8 TAGE | 96 Stunden |
| 8 Schichten | 9-10 TAGE | 140 Stunden |
Wir fertigen sehr komplexe und spezielle flexible Leiterplatten wie die folgenden:
