Rigid PCB board is a conventional Printed Circuit Board. It cannot be bent or flexed.
A Rigid PCB board is one of the important components of electronics product manufacture. Almost every electronic product must be used PCB board, from small watches, and calculators to computers, electronic communication equipment, and even military weapon systems.
Single sided flex PCB the simplest Flex board, it has only one copper layer. It is usually processed on the basis of two raw materials: “base material, glue and copper foil” and “coverlay and glue”. The base material used by flexible printed circuit is generally polyimide (PI), but not limited to, it can also be polyethylene terephthalate, aramid fiber ester and polyvinyl chloride.
2 Layer flexible printed circuit contains top and bottom sides copper, it’s increased the wiring density per unit area. Generally, when the wiring of the circuit is more complicated, and the single sided flex PCB cannot meet the wiring requirements, the 2 Layer flexible circuit board will be selected. Compared with single sided Flex PCB, the biggest difference between 2 Layer flexible circuit board is added vias structure to connect two layers of copper foil (that is, two layers of conductive patterns) to form a conductive path.
4 Layer flexible printed circuit is to press single sided and 2 Layer flex PCB together, metallized through holes and electroplating, and form conductive paths between different layers. In this way, no complicated welding process is required. Compared with single side flex PCB and 2 Layer flexible circuit board, 4 Layer flexible PCB has higher reliability, better thermal conductivity, and more convenient assembly. But it loses the excellent flexibility of single and 2 Layer flexible circuit board. However, there is also a compromise option, that is 4 layer Flex PCB.
Flexible printed circuit boards can be bent, wound and folded freely. Also it can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched in three-dimensional space arbitrarily, so as to achieve the integration of component assembly and wire connection
The use of flexible printed circuit can greatly reduce the volume and weight of electronic products. Suitable for the development of electronic products in the direction of high density, miniaturization and high reliability.
Flexible printed circuit also has good heat dissipation and solderability and is easy to assemble, low overall cost advantages. The design of the combination of FPC PCB and rigid PCB also makes up for the slight deficiency of the flexible substrate in the load-bearing capacity of the components to a certain extent.
| Article | Paramètres techniques | spécification |
| Largeur/espace minimum de la ligne PCB du PCB flexible | 2/3 mil | Épaisseur du cuivre fini H oz |
| Anneau de protection PCB Min Flex de Via | 3 millions | Distance entre le bord du trou et la périphérie de l'anneau |
| Anneau de protection PCB Min Flex de PTH | 5 millions | Distance entre le bord du trou et la périphérie de l'anneau |
| PCB flexible minimum via la taille | 4 millions | |
| Épaisseur minimale du PCB flexible double face | 0,1 mm | Épaisseur finale du panneau |
| Épaisseur minimale du PCB flexible du multicouche | 0,2 mm | Épaisseur finale du panneau |
| Épaisseur maximale du PCB flexible | 0,35 mm | Épaisseur finale du panneau |
| Dimension maximale du PCB flexible | 260×620 millimètres | PCB simple et double face |
| Espace entre la ligne et le bord de la planche | 8 millions | Fraisage du contour |
| Couches de PCB Max Flex | 8 couches | |
| Couleur du masque de soudure Flex PCB | Jaune, Noir, Blanc | |
| Couleur de sérigraphie Flex PCB | Blanc noir | |
| Finition de surface de carte PCB FPC | ENIG,ENEPIG,ImAg,ImTin,OSP, placage à l'or | |
| Épaisseur maximale de cuivre de finition | 3 onces | |
| Épaisseur diélectrique | 2,5 millions | |
| Matériau PCB flexible | ShenYi Stand Polyimide, Polyimide sans halogène, adhésif et raidisseur | |
| Matériau du raidisseur flexible | Raidisseur FR4, raidisseur en polyimide, raidisseur en acier |
Les trois éléments du matériau PCB flexible : feuille de cuivre, adhésif, polyimide et polyester.
Copper foil can generally be divided into electrolytic copper foil and rolled copper foil. Electrolytic copper is formed by separating copper ions in copper sulfate solution by electric current, and then it is completed after anti-oxidation and roughening treatment. Its characteristic is strong electrical conductivity, but relatively weak bending resistance. Rolled copper foil is made by rolling the copper plate repeatedly, and its crystallization is a lamellar structure. It has good flexibility.
ADH is an adhesive, which is the most important part in the manufacturing process of flexible copper clad laminates. Many important performance indicators in the board are determined by the performance of the glue. For example: peel strength between dielectric substrate and metal foil, flexural resistance, chemical properties, moisture resistance, adhesive layer flow properties, etc.The adhesive used in flexible copper clad laminates must be able to withstand various process conditions and the erosion of chemicals used in the manufacture of flex printed circuit boards, without delamination or degradation.
Polyimide&Polyester contains PI base Flexible Printed Circuitmaterial, PI coverlay, PI stiffener material PI base material: Flexible PCB printed circuit board materials are divided into two types: those with glue and those without glue. Whether it is a material with glue or without glue, Polyimide is a must indispensable.PI coverlay: Its main function is for circuit insulation.PI stiffener material: It is often used in the area on the back of the whole finger of FPC PCB, and the PI ribs are used to increase the complexity and hardness of the fingers, making it easy to insert and remove.
Mobile electronic devices such as smartphones and tablets, There are flexible printed circuit in the camera module, capacitive screen connection part, button part, optical drive induction head, receiving antenna and other parts of the PC.
Flexible Printed Circuits are widely used in high-tech electronic fields such as communications, computers, instruments, automobiles, medical care, industrial control, home appliances and CNC machine tools, camera modules, and intelligent battery management modules.
Mobile electronic devices such as smartphones and tablets, There are flexible printed circuit in the camera module, capacitive screen connection part, button part, optical drive induction head, receiving antenna and other parts of the PC.
Driven by emerging markets such as 5G and wearable devices, Flexible printed circuit will also use in new growth space.
Flexible printed circuit widely use in Camcorder, CDRW cubic element patch,CD RW drive parts,PDP, Camera Module, Laser Printer Head drive parts, Mobile phone electromagnetic wave shielding.
The flexible printed circuit board material is generally a roll of 250mm wide 50M or 100M long PI base material covered with a certain thickness of copper on one or both sides of the copper foil. Therefore, we need to cut the large roll into a work board according to the size of the manufacturer’s instructions.
Le perçage est la deuxième étape du processus de fabrication des circuits imprimés flexibles, et la qualité du perçage est directement liée à la fonction et à la précision du produit.
Along with the continuous development of high-density flexible PCB, Traditional mechanical drilling technology can no longer meet the market demand for small hole diameter, high precision and high efficiency. Laser drilling has become the mainstream processing technology for flexible PCB microvias.
VCP electroplating line using Faraday’s theorem (the thickness of the coating is proportional to the current density and plating time) to plat the hole wall of the flexible printed circuit board to copper thickness following IPC standard or required by customer.
Composed of PE, photoresist and PET, paste dry film on the flexible printed circuit board, so as to achieve the function of image transfer, and protect the circuit during the etching process.
Selon l'exposition du film correspondant au travail, l'image du film graphique flexible du circuit imprimé est transférée sur le film sec (réalisé dans l'atelier sans poussière de niveau 10 000), et l'équipement principal est une machine d'exposition automatique.
The part of the dry film that is not exposed to light will be washed off by NaCO3, and the dry film on the trace and copper will not be washed off. Useful wiring and copper of flexible printed circuit board are preserved
La gravure flexible de circuits imprimés est le processus consistant à éliminer le cuivre indésirable d’un circuit imprimé.
Etching has acid etching process (ferric chloride and copper chloride) and alkaline etching process (ammonia). The acid method is used to etch the inner layers of flexible printed circuit board, it is accurate and cheap but time consuming. The alkaline method is used to etch the outer layer of the flexible PCB, which is fast and expensive.
Flexible printed circuit board dry film stripping removes the protective dry film layer on the FPC circuit board through a chemical reaction. This process is usually done using chemical solutions, which can decompose the chemical substances in the film layer and expose the flex printed circuit board.
L'équipement de développement et de retrait du film de gravure est une ligne DES horizontale.
Flexible printed circuit board coverlay film, generally also called protective film, protects the circuit from oxidation and covers it for subsequent surface treatment. If the area that does not need gold plating is covered with coverlay. In the subsequent SMT soldering, the role of prevent welding.
Grâce à un pressage à haute température et à haute pression, suivi d'une cuisson à haute température, la colle thermodurcissable entre le film de couverture et le panneau est durcie pour atteindre l'objectif des deux étroitement combinés. Les paramètres de travail de durcissement sont la température 150°C, 1H. L'équipement principal est constitué de presses et de fours rapides ;
Le traitement de surface des circuits imprimés flexibles se fait principalement par immersion or ou ENEPIG. Selon les exigences du client, des métaux tels que le nickel et l'or sont déposés sur les plages exposées des PCB flexibles en utilisant des principes chimiques ou de galvanoplastie pour protéger les plages et maintenir leur soudabilité. L'équipement principal est une ligne plaquée or et une ligne plaquée or.
Check whether there are open and short circuits between different networks of the flexible printed circuit board, four-wire failure, etc. through test fixtures or equipment. The main equipment is an electric test machine and a flying probe test machine;
Le but du collage du raidisseur Flex PCB est de renforcer la résistance mécanique du circuit imprimé flexible et de faciliter le montage des pièces sur la surface du PCB.
Les matériaux de raidisseur FPC sont les raidisseurs courants en polyimide, les raidisseurs FR4 et les raidisseurs en acier.
FR4 stiffener main components are glass fiber cloth and epoxy resin glue, which is the same as the FR4 material used in PCB.
Steel stiffener is made of steel, which has strong hardness and support strength. Manual assembly is required, the process is more complicated, and the cost will be higher.
PI stiffener is as same as the coverlay film, consisting of PI and adhesive release paper, but the PI layer is thicker, can be processed and produced from 0.05mm to 0.25mm, the tolerance can be controlled at +/- 0.03mm, and the precision is high , high temperature resistance (100°C-280°C).
Print the text ink on the flexible printed circuit board through the principle of screen printing, mainly printing the product model, production date code, and various component identifications required by customers, etc. The main equipment includes screen printing machines, ovens, text inkjet printers, etc.;
Flexible printed circuit board punching is a link in the FPC process, which is equivalent to a cutting workstation. At present, the main equipment used in this workstation on the market is flex circuit punching machine and FPC UV laser cutting machine.
Le principe de la poinçonneuse flexible pour PCB consiste à appliquer une pression à travers le cylindre pour pousser le moule à couteau dans le support et réaliser la découpe du circuit flexible en une seule fois.
Le principe de la machine de découpe laser pour circuits imprimés flexibles est d'irradier la surface du FPC avec un faisceau laser à haute énergie et haute densité et de le balayer d'avant en arrière à travers le miroir vibrant pour former une couche coupante de matériau en verre.
Grâce à une inspection visuelle manuelle, un CCD et un équipement permettant d'inspecter entièrement l'apparence et l'état de surface de la carte de circuit imprimé flexible, de séparer les bons produits des produits défectueux et d'effectuer des tests de fiabilité sur le produit pour confirmer s'il répond aux exigences du client.
Packaging and shipping flex circuits are carried out according to customer requirements. The main packaging methods include vacuum packaging, micro-membrane packaging, tray packaging, etc.
King Sun is a Flex PCB manufacturer with high quality and advanced flexible PCB. We make flex PCB prototype with quick turn lead time, below is our quick turn flex circuits list:
| Nombre de couches | Délai de livraison standard | Retour rapide |
| 1-2 Couche | 4-5 JOUR | 24 heures |
| 4 couches | 5-6 JOUR | 48 heures |
| 6 couches | 7-8 JOUR | 96 heures |
| 8 couches | 9-10 JOUR | 140 heures |
Nous fabriquons des circuits imprimés flexibles très complexes et spéciaux comme ci-dessous :
