16 Layer HDI PCB:
- PCB Layer: 16Layer
- Material: FR4 High TG
- Board thickness: 5.08mm
- Finishing copper thickness: inner and outer 2/2oz
- Surface finished: ENEPIG
Technologie spéciale :
- Blind and Buried vias with 0.2mm in L1-L2, L2-L3, L14-L15, L15-L16, impedance control 50 ohm +/-10%
- Contersink Holes
- Impedance Control
- 5.1mm board thickness
- ENEPIG surface
The board uses a special surface finishing ENEPIG, which is fantastic for ping boards.
HDI&Microvia(blindburied) PCB Capability:
Largeur/espace minimum du tracé du circuit : 2,7/2,7 mil |
The Minimum Via Size : 0.1mm |
La hauteur/largeur minimale de la légende : 0,5 mm/0,12 mm |
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin |
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling |
Type de matériau : FR4, noyau métallique, FR4 sans halogène, Rogers, PTFE, Arlon, Nelco, Polyimide |
Maximum Panel Dimension: 1200mm x 600mm |
Épaisseur finale du panneau : 0,4 mm ~ 6,0 mm |
Épaisseur finale du cuivre : HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
Épaisseur du substrat FR4 : 0,1 mm 0,2 mm 0,3 mm 0,4 mm 0,5 mm 0,6 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm 2,36 mm |
Solder Mask Colour: Green White Black Red Blue Yellow |
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation |
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole |