La produzione di PCBA inizia dalla progettazione del PCB

Preparazione preliminare alla progettazione di PCB

PCB board size and layer count need to be determined in the early stages of PCB design. The layer count will directly affect the PCB routing and impedance. The PCB dimension will help to achieve the purpose of PCB design.

Progettazione del layout del PCB

In the PCB design process, the first is the correct layout, which is the most basic PCB design entry requirement. Secondly, the electrical performance, which is a measure of a PCB board is a qualified standard.Once again, optimize the PCB circuit routing to meet test convenience, neat and tidy.

Ispezione della RDC

Quality control is an important part of PCB design. It includes Self-inspection, mutual inspection, special inspection, etc. Check whether the empty foot of each component is normal and whether it is a leakage line. Check whether the upper and lower wiring of the same network table has holes, and whether the pads are connected through the holes to prevent wire breakage and ensure the integrity of the line.

Il secondo passo è la produzione di schede PCB

Di seguito sono riportate le principali procedure produttive dei pannelli multistrato convenzionali.

Taglio materiale: Il materiale da taglio è l'ampia area (48 pollici * 42 pollici) di materia prima che viene tagliata nel pannello di lavoro di cui hanno bisogno i produttori di PCB.

Strato interno: The inner layer of the circuit uses positive imaging technology, After developing, etching, and de-filming processes, complete the production of the inner layer of the line.

Ossido nero: Black Oxide is made before lamination. The main role is to roughen the copper surface and increase the surface contact area with the resin to ensure the quality of lamination.

Laminazione: Stack up the inner core and prepreg to press into multilayer board through vacuum pressure machine. And make the tooling holes for the next process.

Drilling: Using CNC drilling machine, through holes are drilled for circuit connections between layers.

Rame chimico: Electroless copper is chemically deposited, copper. The method deposits a thin copper layer in the non-conductive substrate so that the through-holes are metallization. Then use the plating method to thicken the hole’s copper thickness to achieve the design purpose.

Placcatura in rame: La placcatura in rame è un metodo di galvanica per aumentare lo spessore dei fori passanti e delle superfici dei circuiti.

Strato esterno: Trasferisci il modello esterno sulla piastra rivestita di rame e incidi il rame inutile.

Carattere resistente alla saldatura: Stampa di uno strato di inchiostro per maschera di saldatura isolata sulla superficie dello strato esterno. Su alcuni PCB è inoltre necessario stampare simboli sullo strato della maschera di saldatura.

Surface treatment: Common PCB surface treatments include HASL, OSP, Immersion Gold, ENEPIG, Immersion Silver, Immersion Tin, and Gold finger plating.

Prova elettrica: All the PCBs must be pen/short tested before outgoing, the test included electrical test and flying probe test. Electrical test for PCB mass production and flying probe test for samples as it’s fast turn round.

Tipi di produzione PCBA

Esistono due tipi principali di produzione PCBA: tecnologia a montaggio superficiale (SMT) e tecnologia a foro passante (THT).

Tecnologia a montaggio superficiale (SMT)

L'assemblaggio SMT del circuito stampato è una tecnologia di assemblaggio del circuito che salda i componenti alla superficie di un circuito stampato mediante saldatura a riflusso o saldatura per immersione. La produzione PCBA SMT viene generalmente utilizzata per dispositivi elettronici compatti, leggeri e ad alta densità, come smartphone, tablet e laptop.

Tecnologia a foro passante (THT)

Through-hole Printed Circuit Board assembly also named DIP involves inserting electronic components through pre-drilled holes in the PCB, and then soldering the leads to the other side of the board. Through-hole Printed Circuit Board assembly is used for heavy-duty electronic devices, such as industrial equipment and high-end audio gear.Most electronic devices are the combination of both SMT and THT assembly methods to achieve a balance between size, weight, and durability.

PCBA manufacturing in King Sun can offer a combination of affordability, quality, and scalability that makes it an attractive option for businesses. There are several advantages of PCBA manufacturing in King Sun.

Basso costo

PCBA manufacturing in King Sun is typically much more cost-effective than in many other factories, due to the lower cost of labor and materials.

Alta qualità

Despite the lower cost, PCBA manufacturing in King Sun can still be of high quality. We imported production and testing equipment from the United States, Japan, and other countries to help companies improve PCBA manufacturing and testing capabilities.

Produzione su larga scala

King Sun is one of the largest producers of Printed Circuit boards and PCBA in China, which means that it has the capacity to produce large quantities of circuit boards and PCBA manufacturing quickly and efficiently.

Scalabilità

King Sun has experience in producing circuit boards for a wide range of applications and industries, including automotive, telecommunications, and consumer electronics. This means that we can scale our production to meet the needs of different clients.

Tempi di consegna rapidi

King Sun has our own Printed Circuit Board factory and assembly factory, so the lead times can be very fast than other suppliers, which can be a significant advantage for clients who need their products quickly.

Produzione di schede PCB correlate