What is HDI PCB?

HDI PCB is the abbreviation of high density interconnector PCB. HDI PCB manufacturer makes the HDI board by increased layers through micro-blind&buried vias.

HDI PCB board is a compact product specially designed for small capacity users.

The HDI board includes the following via types:

Microvia PCB: nell'industria dei PCB, i via con un diametro inferiore a 150um (6mil) sono chiamati microvia.

Via sepolte: le vie sono sepolte nello strato interno, generalmente non visibili nel prodotto finito. 

Blind vias: The blind vias are drills from top layer or bottom layer to a certain inner layer. They are not through the whole HDI board. 

Characteristics of HDI PCB Board

Più piccolo e leggero

HDI PCB manufacturer make the HDI PCB board through continuous lamination and laser drilling with a large number of micro-buried blind holes. So it has the advantages of being light, thin, short, and small.

Alta densità

High density interconnect PCB design with more vias, traces, copper pads and inner layers. The via diameter is usually less than 150um, the line width and line spacing do not exceed 76.2um, also the thickness of the interlayer dielectric is less than 80um.

Migliori prestazioni elettriche

HDI PCB boards have better electrical performance due to multiple pressing and plating. In addition, the HDI PCB board has better improvement for radio frequency interference, electromagnetic wave interference, electrostatic discharge, heat conduction, etc.

Requisiti elevati per i plug-via

At present, HDI PCB board buried& blind vias plugging technology is painful for HDI PCB manufacturer. Quality problems will involve vias cavity,uneven dielectric thickness and uneven board edge if HDI PCB manufacturer does not do well with buried and blind vias.

Features of HDI PCB Board Manufacturing

The HDI PCB manufacturing process is usually different from that of other standard PCBs, The following are some special characteristics of HDI PCB board manufacturing.

Laminazioni multiple

Lamination of PCB core board, PP and copper foil. Unlike other standards PCBs, HDI PCB boards go through the lamination process multiple times. These continuous laminate structures help prevent movement and breakage during drilling.

Tramite la tecnologia pad

HDI PCB with via in pad technology is that the via be drilled in copper pad and filled with resin or copper materials. Then plating a layer copper to cover the via, so the pad can be used in soldering.

Tipi di vie di riempimento

Via filling type should generally be determined based on specific application and PCB requirements. Filling materials used include chemical plating, silver filling, copper filling, conductive resin, and non-conductive resin. The most common via filling material is a non-conductive resin.

Tecnologia di perforazione laser

Laser drilling is widely used in HDI PCB design. The laser heads can produce laser light up to 20 microns in diameter. It’s easy to cut metal and fiberglass and produce very small and clean vias. Using smooth glass fibers with a lower dielectric constant allows for smaller vias.

Features of HDI PCB Board Manufacturing

The HDI PCB manufacturing process is usually different from that of other standard PCBs, The following are some special characteristics of HDI PCB board manufacturing.

Laminazioni multiple

Lamination of PCB core board, PP and copper foil. Unlike other standards PCBs, HDI PCB boards go through the lamination process multiple times. These continuous laminate structures help prevent movement and breakage during drilling.

Tramite la tecnologia pad

HDI PCB with via in pad technology is that the via be drilled in copper pad and filled with resin or copper materials. Then plating a layer copper to cover the via, so the pad can be used in soldering.

Tipi di vie di riempimento

Via filling type should generally be determined based on specific application and PCB requirements. Filling materials used include chemical plating, silver filling, copper filling, conductive resin, and non-conductive resin. The most common via filling material is a non-conductive resin.

Tecnologia di perforazione laser

Laser drilling is widely used in HDI PCB design. The laser heads can produce laser light up to 20 microns in diameter. It’s easy to cut metal and fiberglass and produce very small and clean vias. Using smooth glass fibers with a lower dielectric constant allows for smaller vias.

Capacità di fabbricazione

Articolo Parametri tecnici    Specifica
Larghezza/spazio minimo della linea del circuito 2,7/2,7 mln Spessore Rame Finito H oz
Anello cuscinetto PCB minimo di Via  3 milioni  Distanza tra il bordo del foro e la periferia dell'anello 
 Anello cuscinetto PCB minimo di PTH 5 milioni  Distanza tra il bordo del foro e la periferia dell'anello  
 PCB minimo tramite dimensione 3 milioni  Spessore tavola < 1,2 mm 
 Spessore minimo del PCB di 4 strati 0,4 mm  Spessore finale del pannello
Spessore minimo del PCB del multistrato 0,4 mm Spessore finale del pannello
Spessore massimo del PCB  3,2 mm  Spessore finale del pannello 
 Dimensione massima del circuito stampato 609×450 millimetri  PCB a singola e doppia faccia
 Spazio tra la linea e il bordo della tavola 10 milioni  Fresatura del contorno 
 Numero massimo di strati PCB 40 strati   
Colore maschera di saldatura PCB Verde, Nero, Blu, Rosso, bianco, Giallo,  
Colore serigrafia PCB Bianco, nero, giallo  
Finitura superficiale del PCB HASL,ENIG,ENEPIG,ImAg,ImTin,OSP, Hard Gold Plating  
Spessore massimo del rame di finitura 2 once  
Spessore dielettrico 2,5 milioni  
Materiale PCB FR-4, substrato di alluminio, Rogers4350C, poliimmide  
Tecnologia speciale Foro svasato, tramite PCB pad, PCB cieco e sepolto  

Tipi di PCB HDI

 

Accumulo 1+N+1

Esiste un solo trapano cieco e interrato che collega direttamente due strati adiacenti. Ad esempio, il livello 1 e il livello 2 sono collegati oppure il livello X è collegato al livello (X-1).

Accumulo 2+N+2

Il foro cieco dallo strato esterno del foro passante al terzo strato può essere collegato direttamente allo strato 1-3, oppure può essere collegato allo strato 1-2 e allo strato 2-3 separatamente.

Qualunque strato

Sono presenti connessioni micro-via tra eventuali strati adiacenti. Ad esempio, L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L6-L7,L7-L8… ecc.

Processo di produzione di PCB HDI

Strato interno

The first step is cut material sheet into working panel, then start to make Inner Layer that uses dry film to transfer PCB pattern to the copper clad by exposure and development processes.

King Sun PCB’s inner layer production capability is presently 3mil line/3mil space for Hoz and 1oz copper.

Rivestimento in ossido nero

Black oxide makes core to have a uniform fluff layer that increases the bond strength between the copper foil and prepregs. It also removes grease and burs from the material surface to ensure cleanliness before lamination.

Laminazione dello strato interno

This lamination is made for blind vias and buried vias layers. The first step is stack and fix the prepreg sheet and the oxidized inner layer board in position. Then laminated the copper foils, prepregs and inner layer through automatic pressing machine. 

Some HDI PCBs are multiple laminations for different PCB blind&buried vias designs.

Stackup 1+N+1: questo tipo di PCB HDI è laminabile una sola volta.

Stackup 2+N+2: questo tipo di PCB HDI ha due laminazioni.

Stackup Anylayer: This HDI PCB type is multiple laminations.

Perforazione dello strato interno (vie cieche e interrate)

After first lamination, then blind vias and buried vias will be drilled.

When the via diameter is more than 0.2mm, we will use traditional CNC drilling machine.When the via diameter is less than 0.2mml, we will use laser drilling.

Placcatura dello strato interno

After blind vias and buried vias be drilled, the vias need to be plated before outer layer lamination. Board thickness and via diameter aspect ratio is not more than 10 to ensure the via wall plating is good.

Laminazione dello strato esterno

The next PCB manufacturing processes are as same as standard multilayer PCB.

L'applicazione del PCB HDI

  • Mobile communication devices and notebook computers. Moreholes, light weight, small size, strong function.
  • Computer and network communication equipment and large equipment. Few holes, high layer acounts, impedance control for transmitted signal trace.
  • Portatrucioli per imballaggi LSI, inclusi pad e flip chip, ecc. Larghezza e spaziatura della linea ridotta (generalmente inferiore a 2 mil), alta precisione, apertura piccola (1-2 mil), spaziatura dell'apertura piccola (≤ 5 mil), buon calore resistenza e piccolo coefficiente di dilatazione termica del substrato.

Perché scegliere noi?

Fabbricazione PCB rapida

Possiamo realizzare prototipi PCB con tempi di consegna molto rapidi:

Conteggio degli strati Tempi di consegna standard Girarsi velocemente
1-2 strati 4-5 GIORNI 24 ore
4 strati 5-6 GIORNI 48 ore
 6 strati 7-8 GIORNI 96 ore
 8 strati 9-10 GIORNI 140 ore
 10 strati 10-12 GIORNI 192 ore
 
Tecnologie PCB complesse

Realizziamo PCB molto complessi e speciali come di seguito:

  • Tramite il PCB del pad
  • PCB per monete in rame incorporato
  • PCB con perforazione posteriore
  • PCB con slot di profondità
  • PCB con foro svasato
  • PCB con vie cieche e interrate