Rogers RO4350B and RO4003C are the most common series materials in the Rogers family. They are used in the manufacture of Rogers PCB as hard and dense material properties. Widely used in high-frequency power distribution and CUP circuit boards, switches, connectors, etc.
RO4350B and RO4003C have superior dielectric constant and temperature stability. The dielectric constant thermal expansion is very consistent with the copper foil. It can be used to improve the deficiencies of PTFE substrate. Suitable for high-speed designs, as well as commercial microwave and RF applications.
Due to its extremely low water absorption, it can be used for high-humidity environments, providing customers in the high-frequency board industry with the highest quality materials and related resources, and fundamentally controlling product quality.
The Rogers PCB material RO4003C RO4350B contains an epoxy resin core, metal-clad copper, and aluminum elements. They have good dimensions and advantages in thermal expansion coefficient, which can effectively control the temperature stress to ensure the stability of component performance.
They are most commonly used in RF PCB assembly because of their sensitivity to electromagnetic (EM) waves (usually in the radio spectrum). This helps reduce interference from other high-frequency devices such as radios, TVs, and cell phones.
Rogers PCB materials RO4003C RO4350B also have excellent dielectric integrity and are designed for use on high-performance RF circuit boards.
The materials have excellent electrical and thermal stability, making them are the ideal choice for harsh environments exposed to extreme temperatures and vibrations.