What Is Rogers PCB-rogers pcb material

What is Rogers RO4003C, RO4350B material?

Rogers PCB RO4003C, RO4350B material is a high-frequency material type produced by Rogers company.

Unlike the traditional FR4 PCB, they don’t have glass fiber in the middle. They use a ceramic base for high-frequency material.

Rogers RO4350B and RO4003C are the most common series materials in the Rogers family. They are used in the manufacture of Rogers PCB as hard and dense material properties. Widely used in high-frequency power distribution and CUP circuit boards, switches, connectors, etc.

RO4350B and RO4003C have superior dielectric constant and temperature stability. The dielectric constant thermal expansion is very consistent with the copper foil. It can be used to improve the deficiencies of PTFE substrate. Suitable for high-speed designs, as well as commercial microwave and RF applications.

It has very low water absorption. So, it can be used in high-humidity environments. This gives high-frequency board industry customers the best materials and resources. It also lets them control product quality.

The Rogers PCB material RO4003C RO4350B contains an epoxy resin core, metal-clad copper, and aluminum elements. They have good size and a low thermal expansion coefficient. This can reduce temperature stress and keep the component stable.

They are most commonly used in RF PCB assembly. This is because they are sensitive to electromagnetic (EM) waves, usually in the radio spectrum. This helps reduce interference from other high-frequency devices. They include radios, TVs, and cell phones.

Rogers PCB materials RO4003C and RO4350B have excellent dielectric integrity. They are designed for use on high-performance RF circuit boards.
The materials have great electrical and thermal stability. They are the ideal choice for harsh environments with extreme temperatures and vibrations.

How to choose Rogers PCB Material thickness?

Rogers PCB materials come in many thicknesses and sizes. The most common thicknesses are: 0.127mm,0.254mm,0.381mm,0.508mm,0.787mm,1.575mm, and 3.175mm.

Standard Thickness

This type of high-frequency board is for applications with small gaps between traces. It provides good electrical performance, especially at higher frequencies.

This type of board also has better thermal properties than thin sheets. It is ideal for applications where heat dissipation is important.

Thin Thickness

Thin-thickness Rogers PCBs have lower electrical losses than standard PCBs. This is because they have more surface area and so less electrical resistance

They also offer better protection from electrostatic discharge (ESD) than standard-thickness boards. This is because they are more resistant to electrostatic charges.

The standard dielectrics in flex circuits are 0.001 – 0.002″. This relatively thin material layer separates the copper traces and components on the flex circuit board.

The thickness of this layer determines how easily the material can be bent. It can bend without disrupting connections or causing short circuits.

The most common materials used to make this dielectric are polyester and polyamide materials. They are usually coated with a conductive material like silver, aluminum, or copper. They act as electrical conductors between traces on the board’s surface and between components.

Rogers PCB Board Materials Series

RO3000 Series

The models are based on ceramic-filled PTFE circuit material. They are: RO3003, RO3006, RO3010, and RO3035 high-frequency laminates.

RO4000 Series

RO4003C, RO4350B with Prepreg RO4450B, RO4450F, RO4500.

RT6000 Series

It is based on ceramic-filled PTFE circuit material. It is for electronic and microwave circuits that need a high dielectric constant. The models are RT6006 dielectric constant 6.15 and RT6010 dielectric constant 10.2.

TMM series

The composites are based on ceramics, hydrocarbons, and thermosetting polymers. There are several types: TMM3, TMM4, TMM6, TMM10, TMM10i, and TMM13i. etc.

The advantages of Rogers RO4003C, RO4350B material

Twisting Warping Stability

An ordinary FR4 PCB is made of bonded copper foil and substrate bonded. The substrate is usually glass fiber (FR-4), phenolic resin (FR-3), aluminum base, copper base, PTFE, composite ceramics, or other sticky materials. The mixture is usually phenolic or epoxy. Thermal stress, chemicals, bad production, and other factors during PCB processing, or uneven copper plating during design, can cause the PCB to warp.

The Rogers RO4003C RO4350B is hard. It has good heat dissipation and a low thermal expansion coefficient. At the same time, the Rogers RO4003C RO4350B PCB is bonded to the copper and the substrate by magnetron sputtering. The bonding force is strong, the copper foil will not fall off, and the reliability is high. , to avoid the PCB board warping problem.

Large carrying capacity

RO4003C RO4350B is 100A current continuously passes through 1mm0.3mm thick copper body. The temperature rise is about 17℃; 100A current continuously passes through 2mm0.3mm thick copper body, the temperature rise is only about 5℃.

Coefficient of thermal conductivity

Rogers RO4003C and RO4350 PCB boards have alumina thermal conductivity of 15~35. Aluminum nitride can reach 170~23. Its thermal expansion will be more matched in the case of high bonding strength. The test’s tensile value can reach 45 MPa.

High thermal conductivity

The high thermal conductivity aluminum substrate is generally 1-4W/M.K.
Rogers RO4003C and RO4350B PCB material can reach about 220W/M.K. This depends on the preparation method and material ingredients.

Lower thermal resistance

RO4003C RO4350B has good thermal resistance:

10×10mm ceramic substrate is 0.31K/W for a 0.63mm Rogers PCB material

0.19K/W for a 0.38mm Rogers PCB material.

0.14K/W for a 0.25mm Rogers PCB material.

Good insulation performance

Rogers PCB material RO4003C and RO4350B has good insulation. It has a high withstand voltage, which ensures personal safety and equipment. The two materials have a strong bond. They use bonding technology. The copper foil will not fall off. It is highly reliable and stable in high temperature and high humidity.

Stable high frequency performance

Rogers circuit board material has stable high-frequency performance. Its AK and DK values are lower than PTFE.

Rogers RO4003C, RO4350B vs. FR4 PCB

Based on performance, FR4 PCB is a good substrate. Rogers RO4003C and RO4350B PCB are excellent. So, FR4 PCBs are best used in the best environment for mid and low-frequency applications. However, Roger PCB is used for high performance in niche areas such as space applications.

Impedance Stability

Impedance stability is the difference between FR4 and Rogers PCB. The higher the dielectric constant, the higher the impedance stability. FR4’s maximum dielectric constant is 4.5. In contrast, Roger PCB RO4003C and RO4350B have a higher and wider range of values from 6.5 to 11.

rogers 4350b-rogers 4003c-Material-heat-resistant

Thermal Management

In high-speed applications, a PCB circuit board will generate much heat. It must be handled carefully with a good thermal system. In this case, Rogers PCB is the best choice. FR4 PCBs cannot handle high temperatures, so they will fail in such applications.

printed circuit board manufacturer Resistant to wear and tear kingsunpcb

Dissipation Factor

The dissipation factor represents the PCB signal loss. Rogers PCB materials RO4003C and RO4350B have much lower losses than FR4 PCB. FR4 PCB dissipation factor is 0.02%, and Rogers PCB dissipation factor is 0.004%.

Hygroscopicity and Substrate

Moisture absorption is directly related to the electrical and thermal properties of the substrate. This in turn affects the performance of the board. Rogers PCBs have the lowest moisture absorption. So, they work best in many conditions.

The Application of Rogers PCB

Rogers PCB is widely used in many fields due to its advantages:

  • High-power power electronic modules
  • Solar panel components
  • High-frequency switching power supplies
  • Solid-state relays
  • Automotive electronics
  • Aerospace
  • Military electronic products
  • High-power LED lighting products
  • Communication antennas
  • Automotive
  • Sensors
  • Cooling chips

High Power Electronic Modules


Solar Panel Components


High Frequency Switching Power Supplies