Blind PCB:
- Solder mask: Solder mask green, silkscreen white
- PCB Material: FR4
- Board Thickness: 1.6mm
- Surface Finishing: ENIG
- Finished Copper thickness:1/1 OZ
Special Process:
Blind L6-L8
HDI&Microvia(blind buried) PCB Capability:
Minimum Circuit Trace Width/Space: 2.7/2.7mil |
The Minimum Via Size: 0.1mm |
The Minimum legend Height/Width: 0.5mm/0.12mm |
Surface Finishing: HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin |
Special Technology: Blind&buried via, Via In Pad, Backdrill, Small BGA Pad, Impedance control, Heavy Copper, Copper Filled Vias, Countersink hole, Depth Milling |
Material Type: FR4,Metal Core, Halogen Free FR4, Rogers,PTFE,Arlon, Nelco, Polyimide |
Maximum Panel Dimension: 1200mm x 600mm |
Final Board Thickness: 0.4mm ~ 6.0mm |
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm |
Solder Mask Colour: Green, White, Black, Red, Blue, Yellow |
Shaping: CNC Routing, Punching, V-CUT, Depth milling, Castellation |
Special Hole: Blind&buried hole, Depth milling, T-slot, Countersink hole |