Embedded Copper Coin PCB:
- Layers: 2 Layer
- PCB material: FR4
- Board Thickness: 1.6mm
- Surface Finishing: ENIG+soft gold plating 30microinch
- Finished Copper thickness: 1/1 oz
- Solder mask: PSR-4000
- Special Technology
- Soft gold plating 30 microinch
| Minimum Circuit Trace Width/Space: 2.7/2.7mil |
| The Minimum Via Size: 0.15mm |
| The Minimum legend Height/Width: 0.5mm/0.12mm |
| Surface Finishing: HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin |
| Special Technology: Blind&buried via, Via In Pad, Backdrill, Small BGA Pad, Impedance control, Heavy Copper, Copper Filled Vias, Countersink hole, Depth Milling |
| Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide |
| Final Board Thickness: 0.4mm ~ 6.0mm |
| Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
| FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm |
| Shaping: CNC Routing, Punching, V-CUT, Depth milling, Castellation |
| Special Hole: Blind&buried hole, Depth milling, T-slot, Countersink hole |
| Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB |
